Thin samples Si, GaAs, and other semiconductors from the backside to 40um.

Wet decapsulation using acid jet fuming nitric and/or fuming sulfuric acid. Die decapsulation using heat or mechanical techniques.  This process preserves any die level contamination for analysis or when the encapsulant is impervious to chemicals.

Layer-by-layer deprocess and documentation to substrate using wet etching and/or dry etching techniques.  We have extensive experience with CMP copper technology.

This technique is used for transistor level detection of photon emissions (broad range of 500nm to 1.2um).  We can also use complementary techniques to localize heat dissipation.

We can laser or FIB isolate circuits and electrically characterize circuits with eight mechanical probes to our customers specifications.

Non-destructive inspection of wire bond, solder bump, PCB, etc… with measurement capability can be performed on our system. Real time video or digital images of X-ray session can be transmitted to customers the same day we receive the sample.

This service provides non-destructive imaging using ultrasonic waves to detect delamination, voiding, and various features in a sample.

Our system is capable of surface analysis with elemental mapping using backscattered or secondary electron imaging.

Full FA service on qualification failures, yield analysis, or customer returns can be provided by our staff of highly trained professionals. The service comes with a report completely detailing the analysis steps and results.