MAL FIB circuit modification can help you sleep
easier by testing your design improvements in a timely manner giving
you the assurance that your design will operate to specification,
thus reducing the chances of another respin and avoiding the costs
of another mask set.
DEBUG:
With ever shrinking technology nodes and ever
increasing number of metal layers, you have scratched your head time
and again wondering how you are going to probe that one node buried
under a power plane or that one node only available at metal 1. We
can help. MAL’s FIB team can reach most nodes using high aspect
ratio milling capability allowing the creation of probe structures.
If you are in the digital world and need to create a timing delay
element or if you are in need of tweaking an analog circuit, we can
create resistors with an accuracy of +/- 10% in most cases. We are
aware of analog circuit sensitivities to FIB and will take the
necessary steps to ensure that your device parameters will be
minimally impacted by the FIB experiment.
CUSTOMER SAMPLES:
Now that you have debugged your device and have
verified your design change, your customer would like samples to
test out their product at the system level. You have the new masks
and material in the fab, but you will not have the operational
devices for another 6 weeks. MAL’s FIB team can produce prototype
samples allowing you to deliver working devices to your customer
while your production material is still in the fab.
Why should
you use MAL for FIB?
EXPERIENCE:
MAL FIB engineers have performed circuit
modifications on thousands of integrated circuits. Our expertise
ranges from advanced analog and mixed-signal to the most advanced
90nm Copper designs. We are familiar with many of the processes
produced by foundries, including IBM, TSMC, and UMC. Our experience
enables us to perform circuit modifications both efficiently and
reliably. We are able to give accurate estimates of the feasibility
as well as the amount of time your modifications will take to
complete.
At MAL, we continually work with our customers
to meet their specific needs and will make every effort to strive
for quality, honesty, and integrity.
EQUIPMENT:
MAL has recently expanded our FIB circuit
modification capability and capacity with a newly acquired NPTest
(formerly Schlumberger) P3X in addition to our existing P2X. The
use of both systems allows us to react quickly to your design
verification, debug, and customer sample needs.
P3X specifications:
-
< 5 nm Resolution
-
CAD navigation (both Schlumberger and Knights)
-
Pt deposition
-
Gas assisted etch (metal and dielectric)
-
Insulator deposition (Si02)
-
Copper Etch
-
8” wafer capability
FIB FLEXIBILITY:
MAL can perform FIB edits on a variety of IC
configurations that include:
-
packaged devices (we have decapsulation services available)
-
wafers (200mm, 150mm)
-
cleaved wafers
-
individual sliced die
-
Copper interconnects (90nm)
FIB CAD NAVIGATION CAPABILITY:
The use of CAD navigation greatly enhances the
efficiency of FIB IC modifications and is a mandatory requirement
for IC designs that have more than 3 levels of metal or employ CMP.
MAL can create the CAD navigation database from any GDS2 (stream)
file. We can create both Schlumberger databases and EGSoft Knights
databases.
MAL can provide a temporary FTP account to
facilitate the transfer of the GDS2 files. Many customers choose to
send their GDS2 file on CD.
What does a
FIB modification look like?
What do you
need to do to communicate the FIB instructions?
FIB MODIFICATION SUGGESTIONS:
FIB modifications consist of cuts, jumpers, and
probe pads. We prefer to work from x/y coordinates consistent with
the GDS2 file provided. For each x/y location, please provide the
metal level to eliminate any confusion should layers intersect at
the given location. Once we have your CAD
navigation database, we can react quickly to changes or additions to
your requested modifications by using a standardized format for
describing the edit via email. We can also work with plots to
interpret the FIB modification(s). Mirrored plots are OK, but
please let us know that the plot is mirrored. Please be sure that
you provide a legend for each layer represented in the plot.
Who are the
FIB guys?
Richard San Martin (
sanmartin@fa-mal.com )
Richard San Martin has over 5 years of circuit
modification experience. He has a Bachelor’s degree in Physics from
the University of Texas, Austin. Before joining MAL, Richard
obtained Member, Group Technical Staff at Texas Instruments while
perfecting his FIB skills. Richard has edited thousands of devices
which include advanced analog, mixed-signal, RF, and 90nm Copper
technologies. Richard continues to research new methods which make
FIB circuit modifications more efficient and reliable. When Richard
is not chained to the FIB, he enjoys computer gaming as well as
joining his wife for a ride on their horses across countryside.
Jason
Parker (
jparker@fa-mal.com )
Jason Parker
has over 10 years of industry experience. He has a Bachelor’s
degree from Texas A&M University, College Station. Before joining
MAL, Jason obtained Member, Group Technical Staff at Texas
Instruments while leading a team to implement design debug
capabilities. He has worked with FIB, E-beam, and an assortment of
failure analysis equipment and software for his entire career within
the semiconductor industry. When Jason leaves the FIB cave, he
enjoys spending time on the lake with his wife and 3 year old twins.
